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Multiple-layer
HTCC Feedthrough
Package |
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 Typical
Packages |
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HTCC
Package with RF
Connector |
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HTCC
Package with Sapphire
Window Lens |
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TOSA/ROSA
Package |
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General Information |
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Surface Finish: |
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2.5¦Ìm
min electrolytic nickel per QQ-N-290,
followed by 1.0¦Ìm per MIL-G-45204, Type III,
Grade A. |
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Plating must pass a bake test at 350 deg c
for 3 min. in air without blister, peeling,
discoloration as seen under 10X mag or
solderability change |
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Hermeticity: 1*10-8 cc He/Sec at 1.0 atm
differtial |
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Lead
Isolation Resistance: Leakage
current<=1.0*10-7A at 250V D.C. |
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Lead
Fatigue: must pass 90 deg arcs with 225g
weigth. |
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Lead
Pull Strength: 0.9kfg min. pulls at 90 deg
to the plane of ceramic |
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Final
assembly package must meet all spec after
300 deg c, 5min reflow |
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Features
and Applications |
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High
Frequency Design, ideal for high speed
devices |
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Enhanced thermal conductivity, ideal for TEC
installation |
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DWDM,
WWDM, WDM, EDFA, tunable laser, EA, SOA, and CW
Optical Packages for the |
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industries of Telecom, Space, Medical and Military,etc
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Typical
Packages |
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| The
packages listed here are only samples of our
typical packages; on custom demands we advise
you of optional and optimal package solutions,
contact us now. |
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